依工单上所指示之发料数和尺寸图，將基板裁切成所需之工作尺寸
Cut according to the quantity and size of working panel listed on the travel card

修饰裁切后之基板板边,使之平滑,減少板面间及后续制程对涂布轮、底片之刮伤
Edge grind to ensure smooth and reduce scratch by coating tracks and films.
 

利用药水及磨刷轮与PCB板铜面进行化学/物理反应，达到清洁/粗化铜面目的。
Chemical reactions between brush track and surface of PCB by chemicals to keep clean and coarson the surface.
 

利用滚轮涂布方式在PC板双面垂直覆盖一层感光油墨  Put LPRI on the surface of PCB in vertical direction by track coating.

 利用紫外线(UV)的能量﹐透过底片照射在板面的感光油墨上﹐使油墨中的光敏物质发生光聚合反应﹐完成影像转移的目的
The PCB with LPRI expose in UV light which penetrates through films to transfer image from film to PCB  by photopolymerization.

將未受光区域及其膜下之铜层分別用显影液及蚀刻液去除,最后再用去膜液將感光抗蚀层剥除,形成之內层线路图像.
Remove the copper in unexposure area and under film by developing solution and etching solution. And then strip the photosensitive corrosion resistant layer by solution to pattern in inner layer.
 

 利用CCD镜头抓取投射在板面上”反射光图像”原理﹐对蚀刻后的板面進行扫描﹐并与CAM图像对比﹐进行断路﹑短路﹑残铜﹑缺口等不良点的判读 Implement AOI inspection comparing with CAM data by CCD to avoid open/short/coppper residue/nick defect and so on.

利用CCD抓取靶標中心，配合Spindle对靶标进行中心貫穿作业。Get the target centre by CCD and run through the PCB by spindle.