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PCB流程二 |
2014-12-24 13:52:27 |
利用化学微蚀方式粗化铜面並用棕化药水在铜面生成一层氧化铜,增大铜导体与树脂的接触表面积增强结合力 Coarsen the surface by micro-etching and form copper oxide on the surface by brown solution,add the adhension between conductor and resin. |
将组合后之多层板与铜箔/PP进行叠合以利后续压合作业 Multilayers after combination should be lay up with copper foil and PP.
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将叠合好的待压板利用高温高压的方式熔合黏结成多层板 Multilayers after lay up should be bonded by high temperature and pressure.
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將压合好之冊板与 lay up 相反程序拆出分开叠放. Use the mark line to unload the finished laminition boards which is just oppsite with the lay up procedure and separate them one by one. |
通过X-RAY /CCD对位系統抓取內層靶标,再利用高速运转的主軸配合钻头将其定位孔钻出 Get the target in inner layer by X-ray/CCD and drill location hole by drill bits and spindle with high speed. |
利用捞边机将板边多余流胶去除。 Performing LM routing cut the useless flowed resin on the boards edge. |
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